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For Various & Flexible Production
High-Precision for various PCB Processing
High-Speed & High-Precision for FCBGA
The Global Standard, Stable Process Quality
CO2 Laser Proccessing Machine for New Generation Package PCBs
Hole Diameter
65 - 200 um
Hole Diameter
65 - 200 um
Hole Diameter
50 - 200 um
Hole Diameter
30 -150μm (Cu Direct)um
Applicable PCB
BGA / CSP / FC-BGA
Applicable PCB
HDI/BGA/CSP/FC-BGA
Applicable PCB
HDI / BGA / CSP
Features
Achieves high-precision hole position accuracy at the highest level in the world Achieved 20,000hole/sec. with high power laser head and nwe optical sysytem.
Features
Stable, mass-production processing brought to you in high quality by the world's leading advanced technology.
Features
HIgh productivity and high precision with 2-panel 4-beam machine, with the unique multi-beam sectroscopy and high speed galvano for small hole drilling, high frequency laser head （Max.10kHz）.
Features
With our unique pulse control technology for various PCB processing - Surface treatment, Cu-Direct processing, Conformal Processing and the others.
Features
1-panel 1-beam machine suitable for FPC. Applicable for smaller hole drilling (50um) and laser cutting. Suitable for various kinds, middle or small volume production.
