A5 Neo
Product detailsDescription
The A5 Neo combines affordable flying probe technology with atg's enhanced measurement methods for rigid and flexible PCBs, supported by versatile application software.
Products
Flying Probe Tester PCB
The A5 Neo combines an affordable technology with all of the enhanced measurement methods of probe systems. With the new pneumatic tension shuttle the A5 Neo can test a wide range of products.
Union Tool Drilling Apparatus
PCB Drills / Routers / Ultra precision micro-hole drill
Union Tool tungsten carbide cutting tools for electronic PCB manufacturing include standard PCB drills and routers, diamond-coated routers, ULF coating, and ultra-precision micro-hole P Series drills. Technical information resources support tool selection across drill and router applications.
https://www.uniontool.co.jp/en/product/drill_router/
PCB Tools-related equipments
Union Tool PCB tool-related equipment supports drill preparation, ring setting, and in-process inspection. The line includes automatic and manual ring setting machines (RSM-A, RSM-M1, RSM-M2), digital passameters (DS-1), and OPTECH non-contact drill diameter and runout measurement systems (OPTECH-M, OPTECH-RI-V).
https://www.uniontool.co.jp/en/product/pcb/
Measuring Instruments
Union Tool measuring instruments provide digital inspection solutions for PCB production quality control, including digital scale series and digital passameter products such as DS-2000 for accurate dimensional verification.
https://www.uniontool.co.jp/en/product/dm/
Bare Board Testing
atg LM Test Systems
PCB and Substrate Test Systems
Manual flying probe for PCB test
Manual flying probe systems for rigid and flexible PCB electrical test, offering scalable head counts, shuttle handling, and advanced measurement capabilities for prototype through production panel applications.
A7 Pro
Product detailsDescription
The A7 Pro builds on the A7 platform with 1 GB/s Ethernet, faster rotation and Z-axis drives, and about 20% higher mechanical speed.
A7-16 Pro
Product detailsDescription
The A7-16 Pro extends the A7 Pro platform to 16 test heads and larger panel formats while keeping the same performance level.
Description
The A9 is atg's fastest PCB flying probe system, using powerful linear drives and granite base accuracy for efficient mid-volume testing without fixtures.
Description
The A9L extends A9 head technology with a universal shuttle for larger panels, combining high speed with accurate large-format production testing.
A9XL
Product detailsDescription
The A9XL is the largest-format A9 family model, designed for super-large panels with the same high-accuracy drive platform as the A9L.
A9 plus
Product detailsDescription
The A9 Plus uses A9 technology with ultra-high-resolution cameras, optimized for substrate-like PCBs and other ultra-fine products.
Automated flying probe for PCB test
Fully automated flying probe test systems for lights-out PCB production, supporting flexible panel handling, dual-shuttle throughput, and high-volume manufacturing workflows.
A7a Pro
Product detailsDescription
The automated A7a Pro delivers flexible lights-out panel testing with A7 Pro performance, high-mix throughput, and 2D code-based multi-part-number setup.
Description
The fully automated A9a uses linear motion technology for lights-out production and reliable testing of ultra-fine PCB designs.
A9aL
Product detailsDescription
The automated A9aL brings A9a linear-motion automation to larger panel formats for both automated and manual test workflows.
A9a plus
Product detailsDescription
The A9a plus adds temperature control and high-resolution optics to the A9a platform for substrate-like PCB and advanced packaging test.
Flying probe for substrate test
High-accuracy flying probe systems engineered for advanced substrate applications, combining ultra-fine structure test capability with granite-frame stability and high-resolution optical alignment.
Description
The S3 offers an economical substrate test solution with granite-frame stability, ultra-fine pad capability, and high throughput for reference and capacitance testing.
S3-8
Product detailsDescription
S3-8 is the double-sided evolution of S3, with eight heads and flexible shuttle handling for double-sided substrate ohmic and Kelvin testing.
Fixture based test systems
Fixture-based universal grid test systems for high-throughput bare board electrical test, supporting universal and dedicated fixtures with precision alignment and advanced Kelvin measurement methods.
LM1000
Product detailsDescription
The LM1000 is a compact automated step tester for HDI bare boards, with dual shuttle handling, camera alignment, and universal or dedicated fixtures.
PCB Manufacturing Equipment
VIAMECH
Drilling, Laser and Routing Solutions
PCB Drilling Machine
VIAMECH PCB drills deliver high-speed, high-precision mechanical drilling for HDI, package substrates, and automotive PCBs.
ND-1A221 / ND-1A281
Single-station modules for small-lot, multi-product work—from high-precision production to R&D.
- Drill Diameter
- Φ0.1～φ6.35 mm
- Spindle Speed
- 160k rpm, 200k rpm
- Applications
- PCB, HDI, BGA/CSP/FC-BGA, automotive
- Features
CCD vision compensates X, Y, and θ axes for back-drilling, flip processing, and high-precision work.
ND-6A2226 / ND-6JA2528
Versatile world-standard platform for automotive PCB, high-frequency substrates, and back drilling.
- Drill Diameter
- Φ0.1～φ6.35 mm
- Spindle Speed
- 160k rpm, 200k rpm
- Applications
- PCB, HDI, BGA/CSP/FC-BGA, automotive
- Features
ND-6A2226 covers automotive PCB, HF substrates, and back drilling. ND-6JA2528 drills large panels with integrated servo control.
ND-6MA2126 / ND-6QA2126
350k rpm high-speed spindle drill built for small-hole drilling with unmatched speed and precision.
- Drill Diameter
- Φ0.05～φ3.2 mm～φ4.0 mm (VM Criteria)
- Spindle Speed
- 300k rpm, 350k rpm
- Applications
- PCB, HDI, BGA/CSP/FC-BGA, automotive
- Features
XYZ servo control with standard hovering function to boost productivity.
ND-6IC Series
Six-station drill with CCD vision on every station for individual axis compensation.
- Drill Diameter
- Φ0.1～φ6.35 mm / Φ0.05～φ4.0 mm
- Spindle Speed
- 160k rpm, 200k rpm, 300k rpm, 350k rpm
- Applications
- PCB, HDI, BGA/CSP/FC-BGA, automotive
- Features
Per-axis compensation for multilayer boards, back drilling, and package substrates; CCD corrects position, scale, and orientation.
ND-12MA2126 / ND-12QA2126
PKG drill with 12-head spindle; dual-spindle simultaneous panel processing for high throughput.
- Drill Diameter
- φ0.05～φ3.2 mm～φ4.0 mm (VM Criteria)
- Spindle Speed
- 300k rpm, 350k rpm
- Applications
- PCB, HDI, BGA/CSP/FC-BGA, automotive
- Features
Dual-spindle single-panel processing boosts package-substrate productivity and saves space vs. two 6-station machines.
Laser Processing Machine
CO2 and UV laser systems for HDI, package, FPC, and multilayer boards—micro via drilling and semi-additive processing.
LC-2QS252
General-purpose CO2 laser processing machine for HDI and package PCBs.
- Number of panels/beams
- 2 panels / 2 beams
- Applications
- HDI, package, FPC, and multilayer boards (automotive, comms, server)
- Features
High-speed CO2 processing with in-house core tech. VIA modulation controls pulses to reduce heat effects and bottom damage.
LU-2QS252
General-purpose UV processing machine for FPC and package PCBs.
- Number of panels/beams
- 2 panels / 2 beams
- Applications
- HDI, package, FPC, and multilayer boards (automotive, comms, server)
- Features
UV micro-hole processing on various materials. Optional high-speed trepanning and picosecond oscillator.
LC-4NL212
Semi-additive process CO2 laser processing machine for package substrates.
- Number of panels/beams
- 2 panels / 4 beams
- Applications
- HDI, package, FPC, and multilayer boards (automotive, comms, server)
- Features
In-house galvano and zero yaw for high-volume, high-accuracy processing. Glass-master positioning compensation.
LU-4NP212
Semi-additive process UV laser processing machine for package substrates.
- Number of panels/beams
- 2 panels / 4 beams
- Applications
- HDI, package, FPC, and multilayer boards (automotive, comms, server)
- Features
Temperature-controlled stable hole placement. Original optics for micro holes; optional picosecond oscillator.
LUC-2K Series
UV + CO2 laser processing machine for automotive and communication PCBs.
- Number of panels/beams
- 1 panel / 2 beams (UV: 1 beam, CO2: 1 beam)
- Applications
- HDI, package, FPC, and multilayer boards (automotive, comms, server)
- Features
UV opens copper, CO2 removes resin for inner-layer hole accuracy—ideal for reliable multilayer boards.
PCB Routing Machine
NR Series routing machines combine servo control and specialized structure for high-speed, high-precision routing with optional CCD alignment.
NR Series
Servo routing for high speed and precision. 60k or 80k rpm spindles; NR QIC, spot facing, and optional CCD alignment.
- Product Type
- NR-6RA2126
- Number of Stations / Spindle Spacing
- 6 stations / 538 mm (21.2 inch)
- Max. Processing Area
- 538 x 660 mm (21 inch x 26 inch)
- Spindle Speed
- HB60: 10,000～60,000 min⁻¹; HR08: 15,000～80,000 min⁻¹
- XY Axis Feed Rate
- 50 m/min / 60 m/min
- XY Processing Speed
- 0.101～10 m/min
- X,Y Positioning Accuracy
- ±0.005 mm (with linear scale)
- Processing Accuracy
- 0.05 mm
- CNC
- MARK-55N
Dynachem Laminator
Dynachem supplies a full range of PCB dry film lamination equipment, including automatic cut-sheet laminators, manual and semi-automatic laminators, stand-alone vacuum applicators, in-line vacuum laminators, solder spray systems, handling units, roll-to-roll modules, pre-heaters, industrial controllers, yellow room accessories, and finishing equipment.
The product lines support dry film application, vacuum lamination, panel handling, and yellow room workflows from prototyping through high-volume production. Select a model for the official Dynachem product page and specifications.
Auto Cut-Sheet Laminators
High-throughput automatic cut-sheet laminators for dry film application across the full PCB panel range.
High-technology automatic cut-sheet laminator designed for the full range of PCB dry film application.
Product details
SmartLam tape laminator for automated dry film feed, cutting, and panel lamination.
Product details
Large-format automatic cut-sheet laminator for high-throughput PCB production lines.
Product details
Pre-tack laminator series for accurate dry film registration before final lamination.
Product detailsManual and Semi-Automatic Laminators
Flexible manual and semi-automatic laminators for prototyping, small batches, and integrated vacuum lines.
Manual laminator for flexible dry film application in prototyping and small batches.
Product details
Manual laminator with integrated pre-heater to improve dry film adhesion and process stability.
Product details
Wider-format manual laminator for larger PCB panel dry film application.
Product details
Semi-automatic laminator that reduces operator workload while maintaining process control.
Product detailsStand-Alone Vacuum Applicators
Compact vacuum applicators for precise dry film lamination with high-pressure performance.
High-pressure stand-alone vacuum applicator for precise dry film lamination on large panels.
Product details
Compact vacuum applicator delivering high-performance lamination for standard panel sizes.
Product details
Semi-automatic vacuum applicator combining operator assist with vacuum lamination precision.
Product details
Wider vacuum applicator for extended panel formats and flexible dry film workflows.
Product detailsIn-Line Vacuum Laminators
In-line vacuum laminators and press lines for roll-to-roll and automated production workflows.
Roll-to-roll flat press for continuous lamination of dry film or flexible substrates.
Product details
In-line roll-to-roll vacuum laminator for automated production workflows.
Product details
Combined vacuum press laminator for roll-to-roll PCB dry film processing.
Product details
Fully automatic in-line vacuum lamination line for high-volume manufacturing.
Product detailsSolder Spray Systems
SmartSpray systems for controlled solder mask and coating application.
SmartSpray A24 system for automated solder mask and coating spray application.
Product details
SmartSpray M24 modular spray system for precise and repeatable coating deposition.
Product detailsHandling Units
Loaders, unloaders, accumulators, and cobot handling modules for lamination line automation.
Horizontal loader and stack unloader for automated panel feeding on lamination lines.
Product details
Interleaf rack unloader for orderly removal of separated PCB panels.
Product details
Interleaf unloader designed for efficient panel discharge with separator sheets.
Product details
Vertical loader and unloader for space-efficient panel handling in compact lines.
Product detailsNon-Dynachem Products
Complementary cleaning and finishing equipment distributed by Dynachem.
Teknek cleaning unit for contact cleaning of panels before lamination or coating.
Product detailsRoll to Roll Equipment
Roll-to-roll laminators and unwind/rewind modules for flexible production.
Manual roll-to-roll laminator for flexible dry film application on continuous web.
Product details
Modular double laminator MDL310 for dual-stage roll-to-roll dry film processing.
Product details
Unwind/rewind module 6026 for roll-to-roll material handling and tension control.
Product details
Unwind/rewind module 6126 with extended capacity for wider web lamination lines.
Product detailsSpecial Units
Specialized coating and developing units for advanced PCB processes.
Filler coater DF 1122 for specialized dry film coating and filling applications.
Product details
Diazo developer DD 460 for controlled development of diazo-based dry film processes.
Product detailsPre-Heaters
Pre-heating modules to optimize lamination temperature and adhesion.
Pre-heater PH 8030 to stabilize panel temperature before dry film lamination.
Product details
Pre-heater PH 8130 S1 for consistent heating across standard production panel sizes.
Product details
Pre-heater PH 850 compact module for targeted pre-heating in lamination workflows.
Product detailsControllers
Industrial controller lineup for integrated lamination line automation.
Industrial controller lineup overview for integrated lamination line automation.
Product details
DA3 industrial controller for drive and automation functions on Dynachem equipment.
Product details
EC3 controller for enhanced process control in lamination line operations.
Product details
EN5 controller supporting networked automation and line coordination tasks.
Product detailsYellow Room Accessories
Dry-film handling accessories for yellow room film processing workflows.
Dry film cutting station for accurate film sizing in yellow room workflows.
Product details
Dry-film holder for safe storage and handling of photosensitive film rolls.
Product details
Dry-film trolley for mobile transport of film materials in the yellow room.
Product details
High-temperature release film accessory for demanding lamination process conditions.
Product detailsRefrigerators
Refrigerated finishing units for controlled post-lamination processing.
Refrigerated finishing unit RFU 2036WG for temperature-controlled post-lamination processing.
Product detailsCover Sheet Removers
Cover sheet removal tools for efficient dry film processing.
Mylar peeler MP30.1 for efficient removal of protective cover sheets from dry film.
Product detailsMotoronics X-Ray drilling, Pin Setter, Pc-Clamper, Pc-Remover
Motoronics multi-layer board equipment covering X-ray drilling, lay-up support, pin setting, clamping, and tape removing tools for production lines.
DX-5254 X-Ray drilling machine
Using the new X-ray system (X-ray CCD and X-ray generator). Corresponding to 4 spindle.
- Board Size
- 240×240mm～720×720mm (with)
- Board Thickness
- 0.1～6.0mm
- Spindle
- 5000～40000 rpm
- Drilling Accuracy
- ± 10μm
- Drilling capacity
- φ0.8～6.1
- Processing data
- 200 types
- Machinable range
- X:280～700mm Y:0～600mm
- No. of holes processed
- 2 or more (up to standard 8 holes)
PRD5011 Single-axis X-ray drilling machines
New machine with the best cost performance. High speed and easy operation.
- Board Size
- ～ 610 x 610mm
- Board Thickness
- 0.2 ～ 4.5mm
- Spindle
- 30,000 rpm
- Drilling Accuracy
- ± 20μm
- Tact Time
- 2.1 sec/hole
- No. of Alignment Mark
- One-Hole Mark
- Air
- 10 Nl/min. 6 Kg/cm²
- Data Input
- Touch Panel Monitor
LH-300 Welding Machine for Lay-Up
Rolling up structure of protection tape. Very stable accuracy with totally pressure table.
- Table
- Table change system
- Alignment
- Pin alignment system
- Work size
- 250×290～610×700mm
- Work thickness
- 0.3～5.0mm
- No. of spots
- 6
- Tact
- 25～35 sec
- Temperature set-up
- 320°C max.
- Pre-arrangement
- Needed
DP-240F Dual Pin Setter
With the punching range of multilayer board. Punching head can move freely. The case of the sheet reduces the damage caused by forcibly setting the punch.
- Board Size
- 120 × 120 mm ~ 540 × 690 mm
- PIN Distance
- 110 ~ 670 mm
- Mode
- two surface, one-sided mode, multi-layer mode
- Processing speed (except for timing)
- Surface substrate: 3.5s; Multilayer substrate: 2.5s
- No. of substrates set
- 1 to 4 sheets (1.6t) + resin + aluminum (MAX. 8.02mm)
PC-55 PC-REMOVER
The tape remainder of the backup board is removed, and Bali is prevented. It is easy to use both sides of the backup board.
- Board Thickness
- 2.0～9.0mm
- Tact
- 0.5 sec
- Usage
- Tape-removing for NC
- Power supply
- AC100V 50/60Hz
- Power consumption
- 8W (at one machine)
- Weight
- 10kg (at one machine)
- Dimension
- 130(W)×430(D)×315(H) (at one machine)
PC-40 PC-CLAMPER
Even when board thickness is changed, length of tape is constant. Tape length can be changed freely.
- Board Thickness
- 2.0～9.0mm
- Tact
- 0.5 sec
- Usage
- Tape-removing for NC
- Power supply
- AC100V 50/60Hz
- Power consumption
- 8W (at one machine)
- Weight
- 7kg (at one machine)
- Dimension
- 130(W)×430(D)×315(H) (at one machine)
Laminator Equipment product of JAPAN
MCK Laminator
High Performance Vacuum Laminator Roll to Roll
Vacuum Laminator (Roll to Roll) are introduced in many customers and used in manufacturing process for FPC, COF and Touch panel sensor, FMM. We have much good result and got reliance as No. 1 by customers because of high precision for laminated products.
General Purpose Vacuum Laminator
- Result more than 200 units
- Stable Temp. distribution
- Precise lamination
- No air bubble (No micro void)
- High yield rate
- MVR-250
- 260 / 400
- MVR-500
- 550 / 450
Superior Vacuum Laminator
- Superior engineering with minimum distortion by vacuum.
- Up repeat lamination precision
- Version up of MVR-250/500
- Available for super fine pattern
- MVRS-250
- 260 / 400
- MVRS-500
- 550 / 450
UV Lithography & Processing
Ushio
Charge Neutralization, Lithography & Aligner Systems
Ushio Product Line
Ushio capital equipment for semiconductor and advanced packaging production, spanning charge neutralization systems, roll-to-roll lithography, UV photoresist curing, and manual to panel-level aligner platforms.
Charge Neutralization Systems
Product detailsDescription
Capital equipment using strong deep ultraviolet irradiation to neutralize electric charge on EPROM and Flash memory substrates. Widely adopted in semiconductor manufacturing lines for pre-deposition charge neutralization and plasma-processing charge control.
UFX Series
Product detailsDescription
Roll-to-roll lithography tool for flexible substrates, building on Ushio's proximity and projection exposure expertise with high-output lamps and large-area projection optics for COF, FPC, touch panels and TAB applications.
Unihard
Product detailsDescription
UV photoresist curing system for LSI manufacturing, using super high-pressure and excimer lamps to improve plasma resistance, reduce outgassing during ion implantation, neutralize charge, relieve stress and support low-k curing.
UX-1 Series
Product detailsDescription
Manual contact-proximity mask aligner using Ushio's UV lamp and optical technologies, supporting ihg and deep UV exposure for MEMS, power semiconductors, LEDs, sensors and R&D applications.
UX-3 Series
Product detailsDescription
Automated contact-proximity aligner with Ushio light source and optical systems for high-resolution lithography on wafers up to 200 mm, supporting vacuum contact, hard contact, soft contact and proximity modes.
UX-4 Series
Product detailsDescription
Full-field projection aligner with Ushio's large-area projector lens for one-shot exposure of up to 8-inch wafers without mask contact, enabling higher productivity on non-flat wafers and thick-film resists.
UX-5 Series
Product detailsDescription
Panel-level large-field stepper for FC-BGA, FC-CSP, interposer and advanced packaging substrates, combining Ushio projection lens technology with high-speed step-and-repeat and auto-scale compensation.